Live CompanyLocal Company

TECHNOFORM EDGE BOND SOLUTIONS SINGAPORE PTE. LTD.

UEN: 201836279C · 7 years old

Registered

24 Oct 2018

Officers

8

Industry

MFG. OF WARM EDGE SPACERS &THERMAL EDGE BOND SOLUTIONS FOR INSULATING GLASS

Postal Code

Company Details

Entity Type: Local Company
Status: Live Company
Registration Date: 24 October 2018
Company Age: 7 years
Number of Officers: 8

Business Activity

Primary SSIC: 22219MFG. OF WARM EDGE SPACERS &THERMAL EDGE BOND SOLUTIONS FOR INSULATING GLASS
Secondary SSIC: 46900MFG. OF WARM EDGE SPACERS &THERMAL EDGE BOND SOLUTIONS FOR INSULATING GLASS

Registered Address

6 TEMASEK BOULEVARD #28-06 SUNTEC TOWER FOUR Singapore 038986

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